High‑precision Micro‑machining Technology
We have accumulated profound experience in the processing of semiconductor components. To address the requirements for complex micro‑holes, narrow grooves and high flatness in lithography machine parts, we adopt imported five‑axis machining centers to ensure that positional tolerances of parts in multiple clamping operations reach the micron level. Machining is performed in strictly temperature‑controlled workshops to effectively avoid thermal deformation of aluminum alloy materials and meet the extremely stringent mechanical‑fit requirements of semiconductor equipment.
Stringent Vacuum‑compatible Surface Treatment
The internal environment of lithography machines demands extremely high cleanliness. Our surface‑treatment processes for aluminum parts not only improve the wear resistance and corrosion resistance of components, but also emphasize control over surface micro‑morphology, ensuring the parts produce no outgassing and generate no debris under vacuum conditions. Every semiconductor aluminum part undergoes multi‑stage ultrasonic cleaning and dust‑free packaging prior to delivery, achieving industrial‑grade standards for direct installation and immediate use.
