High‑precision Process Details
We boast profound technical accumulation in the processing of semiconductor aluminum components. In response to the extremely high geometric and positional tolerance requirements for parts in semiconductor equipment, we deploy multi‑axis linkage precision machining centers to guarantee repeat positioning accuracy at the 0.005 mm level even when machining complex cavities of workpieces. By optimizing cutting paths and implementing constant‑temperature workshop management, we effectively restrain thermal deformation during aluminum material processing, ensuring every product meets stringent technical standards.
Rigorous Surface Treatment
Semiconductor operating conditions impose special requirements on the surface performance of aluminum parts. We offer multiple process solutions including clean‑room‑grade anodization, hard anodization and dust‑free surface treatment. We strictly control film‑forming thickness and surface roughness (Ra≤0.4 μm), which not only improves the corrosion resistance and hardness of parts, but also secures their high‑reliability performance under vacuum or corrosive‑gas environments. Highly consistent appearance and performance indicators are maintained from single‑piece prototyping to mass‑volume production.
