High‑precision Thin‑Wall Machining Process
Aiming at the ultra‑thin cavities and heat‑dissipation structures commonly found in semiconductor equipment, we adopt multi‑axis simultaneous‑motion CNC machining centers. Through scientific cutting‑path planning and the development of dedicated fixtures, we effectively address stress release and thermal deformation of thin‑walled aluminum alloy components during machining. Our technical team can keep wall‑thickness consistency within an extremely narrow tolerance range, guaranteeing high vacuum tightness and structural stability of the cavities.
Rigorous Surface Cleaning Treatment
The semiconductor industry imposes extremely stringent requirements on part surface quality. We deliver complete back‑end processes ranging from precision ultrasonic cleaning to controlled anodization. We ensure aluminum parts are free of scratches, residues and micro‑burrs, and can achieve mirror‑grade roughness control of Ra 0.4 and above upon request. Every thin‑walled aluminum part delivered undergoes strict physical and chemical index testing to meet application standards for semiconductor clean‑rooms.
